HONOR Magic V6 ahead of MWC: IP69 foldable puts pressure on Samsung and Google

Published by Timo Altmeyer on February 25, 2026

Just before Mobile World Congress 2026 in Barcelona, ​​HONOR is stepping up its game in the foldable market. The HONOR Magic V6 is set to be unveiled on March 1st at a global launch event, one day before the official start of MWC.

HONOR Magic V6 MWS Teaser Hero

First IP69 foldable announced

HONOR has confirmed that the Magic V6 will be the first foldable smartphone to achieve IP69 certification. This would surpass the current standard in the foldable segment. Until now, the Google Pixel 10 Pro Fold, with its IP68 rating, has been considered the benchmark for water resistance among foldable devices. IP69 means protection not only against dust and continuous immersion, but also against high-pressure and hot water jets.

This is not good news for Samsung. While the Galaxy Z series has improved its water resistance in recent generations, an IP69-rated foldable phone would send a clear technological signal to the market leader.

2800 MPa hinge and reduced rebate

Technically, HONOR is relying on a newly developed hinge made of 2800 MPa steel. This material is intended to significantly increase structural integrity. At the same time, the company announces a reduced visibility of the display crease, which is still considered a critical aspect of foldable devices.

Furthermore, an improved anti-reflective coating will be used, reducing the reflection rate to 1,5 percent. In combination with UTG (Ultra Thin Glass), the internal display should appear more durable and clearer than its predecessor.

In marketing videos, HONOR demonstrates the product's durability. The Magic V6 serves as a supporting element in a zipline structure. While such staged events don't replace long-term testing, they clearly illustrate that HONOR is once again making robustness a core message.

HONOR Magic V6 Design Reveal

Visually very similar to the V5

Visually, the Magic V6 remains close to its predecessor. Among other things, a striking red color variant ("Red Rabbit") was shown, which is also supposed to be available globally.

The device features a round camera module with a triple-camera setup, narrow display bezels, and a punch-hole design on the outer display. The frame has a metallic look, while the hinge appears comparatively delicate. Specific technical details, such as the processor, are still pending, but a current high-end Snapdragon chipset is expected, presumably the Snapdragon 8 Elite Gen 5.

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